Intersil ISL6262
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    Intersil ISL6262 US $ 0.50
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     Technical Support

    BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

    BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours


    Pay attention to the difference between

    leaded (Pb) balls and lead free (No Pb) balls.


    Lead-free/No Pb BGA chips:

    245℃-260℃(Maximun)

    Leaded/Pb BGA chips:

    180℃-205℃(Maximun)


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