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BGA Chips is MOISTURE SENSITIVE DEVICES. 

Devices require baking, before mounting. Here is the general bake-out process. Lay the BGA Chips on the tray, and put it in to a baking dry cabinet.

Set the temperature and time as:

125鈩兟5鈩 x 24 hours or 80鈩兟5鈩 x 48 hours







Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips: 245鈩-260鈩(Maximun)
Leaded/Pb BGA chips: 180鈩-205鈩(Maximun)





Note: If you don't use chips at this time ,please put it into sealed package.

         If device containers cannot be subjected to high temperature or shorter bake times are desired. reference IPC/JEDEC J STD. 033 for bake procedure

 
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