BGA Chips is MOISTURE SENSITIVE DEVICES.
Devices require baking, before mounting. Here is the general bake-out process. Lay the BGA Chips on the tray, and put it in to a baking dry cabinet.
Set the temperature and time as:
125鈩兟5鈩 x 24 hours or 80鈩兟5鈩 x 48 hours
Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips: 245鈩-260鈩(Maximun)
Leaded/Pb BGA chips: 180鈩-205鈩(Maximun)
Note: If you don't use chips at this time ,please put it into sealed package.
If device containers cannot be subjected to high temperature or shorter bake times are desired. reference IPC/JEDEC J STD. 033 for bake procedure
|
HK-LRF 
